2.50mm Pitch 10 Pin R/A DIP Wafer Housing Wire To Board Connector SN Plated
2.50mm Pitch 10 Pin R/A DIP Wafer Housing Wire To Board Connector Sn Plated
| Current Rating | 5.0AMP |
| Contactt Resistance | 10mΩ Max |
| Withstand Voltage | 1500V AC/DC |
| Insulation Resistance | 1000mΩ Min |
| Operation Temperature | ﹣55℃ to +105℃ |
| Contact Material | Brass |
| Contact Plating | Matte Sn over Ni |
| Insulator Material | PBT+30%GF(UL94V-0) |
Product Name: Wafer Wire To Board Connector
1. Wire To Board Connector features: it makes the production process more convenient, more flexible design, reduces the production and maintenance cost, easy repair, and easy to upgrade, improve the flexibility of design
2. Wire To Board Connector material: (UL94V-0) PA9T, PA6T, PA46, PA66 etc.
3. scope of application: used in computer and peripheral equipment, communication products, test instruments, consumer electronics products, automotive industry, medical and electronic products production, military and aerospace industry in which the device connecting the two active devices, current or signal transmission.
Drawing:Wafer WF2512-WRXXGA2.pdf
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