Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity

Wafer Thinning Equipment Technical Overview

Wafer Thinning Equipment enables precision thinning of 4-12inch brittle semiconductor materials including silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), and sapphire substrates, achieving thickness control accuracy of ±1 μm and total thickness variation (TTV) ≤2 μm to meet the stringent requirements of advanced packaging and power device fabrication. Wafer Thinning Equipment through optimized coordination of grinding parameters and polishing processes, the equipment ensures precise adaptation to diverse material properties, particularly addressing the thinning challenges of wide-bandgap semiconductors like SiC. Wafer Thinning Equipment guarantees minimal thickness deviation and low surface roughness, integrated with automated real-time thickness monitoring to maintain stable and reliable processing performance.

Wafer Thinning Equipment Specifications

Advantages:

· Mature and stable processing technology
· High-precision In-Feed spindle grinding with superior machining accuracy
· User-friendly operation and ergonomic HMI (Human-Machine Interface)
· Precision Z-axis control via imported ball screws, linear guides, and high-accuracy servo motors (minimum resolution: 0.1 μm/s)
· High-rigidity air-bearing spindle combined with ultra-precise wafer chuck assembly and thickness gauge ensures process stability and reliability

Functions:

· Operation log recording
· 4"-12" wafer material compatibility
· Real-time high-precision contact thickness measurement
· Spindle water cooling system
· Full-auto/Semi-auto operation modes

Wafer Thinning Equipment photo

                  

Applications

· Silicon-Based Power Device Fabrication: Wafer Thinning Equipment enables wafer thinning processes for DSC and other silicon power devices；

· Compound Semiconductor Device Packaging: Wafer Thinning Equipment supports substrate-level thinning for GaAs/GaN-based components；

· Silicon Carbide Device Processing: Wafer Thinning Equipment delivers precision thinning of SiC ingots/wafers for power module requirements；

Machining effect——Wafer Thinning Equipment

· High-Speed Thinning for SiC, GaN, Sapphire, GaAs, and InP Wafers

· Automated pre-alignment and thickness measurement

· High-rigidity, low-vibration spindle with minimal RPM fluctuation (adjustable creep/rapid feed rates)