Diamond-Aluminum Thermal Composite – Lightweight, High Thermal Conductivity & Low CTE

Product Introduction

The Diamond-Aluminum Thermal Conductive Composite is a high-performance thermal management material that combines the exceptionally high thermal conductivity of diamond with a lightweight and rigid aluminum matrix. This composite offers an excellent balance of high heat dissipation efficiency, low density, low coefficient of thermal expansion (CTE), and strong mechanical performance, making it well suited for applications exposed to vibration, thermal cycling, and harsh operating environments.

By leveraging aluminum’s low density and good processability, diamond-aluminum composites provide a lightweight alternative to copper-based thermal solutions while maintaining superior thermal performance and structural stability.

Key Features

• High Thermal Conductivity: Thermal conductivity exceeding 600 W/m·K, enabling efficient heat spreading

• Low Density: Density of approximately 3.0 g/cm³, significantly reducing overall system weight

• Low Coefficient of Thermal Expansion: CTE below 6.5 ppm/K, improving compatibility with semiconductor devices

• High Mechanical Strength: Flexural strength above 300 MPa, suitable for high-vibration environments

• Excellent Thermal Stability: Maintains performance after 1000 thermal shock cycles from –65°C to 150°C

• Good Surface Quality: Low surface roughness and high flatness support precision assembly

Common Specifications

Application Fields

• Aerospace & Defense
  Suitable for avionics, radar systems, and structural thermal management components where weight reduction and thermal reliability are critical

• New Energy Vehicles
  Applied in power modules, inverters, and battery thermal management systems to improve efficiency and durability

• Data Centers & High-Performance Computing
  Used in high-power processors and cooling modules requiring efficient heat dissipation with reduced structural load

Customization & Processing

Diamond-aluminum composites can be customized in terms of thickness, thermal conductivity, and CTE to meet specific application requirements. Precision machining and surface finishing are supported to ensure compatibility with advanced packaging and assembly processes.

FAQ

1: Why choose diamond-aluminum composites instead of copper-based thermal materials?

Diamond-aluminum composites provide high thermal conductivity (>600 W/m·K) while offering a much lower density (~3.0 g/cm³) compared to copper-based materials. This makes them especially suitable for weight-sensitive applications such as aerospace, defense systems, and electric vehicles, where efficient heat dissipation and structural weight reduction are both critical.

2: How does the low coefficient of thermal expansion benefit electronic applications?

With a CTE below 6.5 ppm/K, diamond-aluminum composites closely match the thermal expansion of semiconductor chips and ceramic substrates. This reduces thermal stress, warpage, and fatigue at solder or bonding interfaces, improving reliability under temperature cycling and vibration conditions.

3: Is diamond-aluminum composite reliable under thermal shock and vibration environments?

Yes. The material maintains stable performance after 1000 thermal shock cycles from –65°C to 150°C, with less than 5% degradation in properties. Combined with its high mechanical strength (>300 MPa) and rigid aluminum matrix, it is well suited for high-vibration and harsh thermal environments commonly found in aerospace, defense, and new energy systems.