Unicomp Technology
                                                                                                           
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Machinery Electronics Production Machinery

AX7900 Real Time Digital X Ray Machine For Switch Inner Defects Inspection

Price Negotiable
Price: can negotiate
MOQ: 1Set
Delivery Time: 30 days
Brand: UNICOMP
Product Description

Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection

 
 
APPLICATION of IC Xray machine AX7900:

  • LED, SMT, BGA, CSP, Flip Chip Inspection.
  • Semiconductor, Packaging components, Battery Industry.
  • Electronic components, Auto parts, Photovoltaic Industry.
  • Aluminum Die Casting, Moulding Plastic.
  • Ceramics, Other Special Industries


Technical Specifications of AX7900


Item Definition Specs
System Parameters Size 1215(L)x1325(W)x1700(H)mm
Weight 1240kg
Power 220AC/50Hz
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 90kV
Max.Power 8W
Spot Size 5μm
X-ray System Intensifier FPD
Monitor 24 ‘’LCD
System Magnification 52X
Detection Region Max.Loading Size 600mm x 520mm
Max.Inspection Area 505mm x 440mm
X-ray Leakage <1μSv/h



Description of IC X Ray machine AX7900:


90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 600mm x 520mm , max. detection area 505 x 440mm, with ~52X Geometric Magnification.


FEATURES of IC Xray machine AX7900:

  • 90KV 5μm X-ray tube, FPD Detector.
  • Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  • Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
  • Multi-function DXI image processing system.
  • X/Y programming function for multiple image inspection routines
  • Max. loading area 600mm x 520mm , max. detection area 505 x 440mm, with ~52X Geometric Magnification.
  • BGA void/area auto-measurement plus report generation.


Inspection Images of IC X Ray machine AX7900:


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Unicomp Technology
Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person James Lee

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