3D X Ray Offline CT Inspection System Unicomp AX9500 For PCB Layers Inspection
Price:
can negotiate
MOQ:
1Set
Delivery Time:
30 days
Brand:
UNICOMP
Product Description
3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection
Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT)
Applications
Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting mold castings, molded plastic parts, etc.
Specifications
| System Summary | |
| Footprint | 1700(W)*1660(D)*1900(H)mm |
| Machine Weight | ≈2700kg |
| Max.Tube Power | 64W |
| Max.Target Power | 15W |
| Max.Voltage / Current | 160kV/1000μA |
| X-Ray Leakage | <0.5μSv/h |
| Imaging System | |
| Tube Type | Open tube |
| Resolution | 1 μm(Optional 0.5μm) |
| Detector | FPD |
| System Magnification | 600X |
| Inspection Area | |
| Max. Inspection Dimension | 530*470mm |
| Max.Load Dimension | 600*545mm |
| Max.Inspection Area (XL Size) | 610*1200mm |
| Motion Control Mode | Joystick Mouse& Keyboard |
| Detector Angle | 360° full viewing angle, 2*70 degree tilt |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
X-Ray images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee