Unicomp Technology
                                                                                                           
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Unicomp AX7900 PCBA X-Ray Machine With High Flat Panel Detector For IC Components Inspection

Price Negotiable
Price: can negotiate
MOQ: 1Set
Delivery Time: 30 days
Brand: UNICOMP
Product Description

PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection
 


Description of IC Xray machine AX7900:
 

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
 

APPLICATION of IC Xray machine AX7900:

  1. LED, SMT, BGA, CSP, Flip Chip Inspection.
  2. Semiconductor, Packaging components, Battery Industry.
  3. Electronic components, Auto parts, Photovoltaic Industry.
  4. Aluminum Die Casting, Moulding Plastic.
  5. Ceramics, Other Special Industries

 

Technical Specifications

Item Definition Specs
System Parameters Size 1100(L)x1100(W)x1500(H)mm
Weight 1000kg
Power 220AC/50Hz
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 80kV/90kV
Max.Power 12W/8W
Spot Size 5μm/15μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 160 X/360X
Detection Region Max.Loading Size 440mm x 400mm
Max.Inspection Area 420mm x 380mm
X-ray Leakage <1μSv/h

 

 

FEATURES of IC Xray machine AX7900:
 

  1. 90KV 5μm X-ray tube, FPD Detector.
  2. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  3. Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
  4. Multi-function DXI image processing system.
  5. X/Y programming function for multiple image inspection routines
  6. Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  7. BGA void/area auto-measurement plus report generation.

 
 
Inspection Images of IC Xray machine AX7900:

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Unicomp Technology
Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person James Lee

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