Advanced X-Ray Inspection Equipment for Electronics Industry 1000kg Maximum Load

Price Negotiable

Price: can negotiate

MOQ: 1Set

Delivery Time: 30 days

Brand: UNICOMP

Product Description

X-Ray Inspection Equipment for Electronics

Description of IC X Ray machine AX7900:

Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal
Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.

APPLICATION of IC Xray machine AX7900:

Large Size Inspection Table,Laser Pinpoint For Precise Location
Accurate Control, CNC Programming,Automatic Positioning
FPD Tilting ±25°
Safely Electromagnetic Interlock
Fingerprint Access Management System
Real-time Monitoring of Radiation

FEATURES of IC Xray machine AX7900:

90KV 5μm X-ray tube, FPD Detector.
Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
Multi-function DXI image processing system.
X/Y programming function for multiple image inspection routines
Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.

Technical Specifications of AX7900

Item	Definition	Specs
System Parameters	Size	1280(L)x1220(W)x1615(H)mm
	Weight	1100kg
	Power	AC 110/220V, 50/60Hz
	Power Consumption	1.0kW
X-ray Tube	Type	Sealed
	Max.Voltage	0~90kV (Adjustable)
	Max.Power	8W
	Spot Size	85μm
X-ray System	Intensifier	FPD(Flat Panel Detector)
	Monitor	22 ‘’LCD
	System Magnification	160 X/360X
Detection Region	Max.Loading Size	440mm x 400mm
Detection Region	Max.Inspection Area	420mm x 380mm
X-ray Leakage		<1μSv/h