Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Price:
can negotiate
MOQ:
1 set
Delivery Time:
15 days
Brand:
UNICOMP
Product Description
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
- BGA/CSP/Flip Chip packaging
- LED & optoelectronic components
- Fuse & diode manufacturing
- PCB & semiconductor assembly
- Battery production
- Small metal castings
- Electronic connector modules & cables
- Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee