High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester
Price:
can negotiate
MOQ:
1 set
Delivery Time:
30-35 days after order confirmation
Brand:
Unicomp
Product Description
High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester
The UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components.
Technical Specifications
| System Summary | ||
|---|---|---|
| Dimensions | 1690mm(L)×2116mm(W)×1880mm(H) | |
| Weight | 4590kg | |
| Power Supply | 220V±10% 50Hz/60Hz 9A | |
| Power Consumption | 2kw | |
| X-ray Tube | ||
| Tube Type | Open Type | |
| Voltage | 160kv | |
| Max. Power | 64W | |
| Focus Spot Size | 1µm | |
| Imaging System | ||
| X-ray Detector | FPD | |
| Pixel Size | 84µm | |
| Detection Area | 129*129mm | |
| Pixel Matrix | 1536*1536[pixel] | |
| Frame Rates | Max 30fps | |
| System Magnification | 34000X | |
| Motion Control System | ||
| Max. Payload Size | 520*520[mm] | |
| Max. Detection Size | 520*520[mm] | |
| X/Y/Z-Axis Travel Distance | 550/710/265[mm] | |
| Tilt and Rotation | Detect XY±70° Tilt | |
| Industrial PC | ||
| Motion Control Mode | 34"HD 4K curved display | |
| Operating System | Windows 11 64-bit | |
| Storage | 4TB HDD+512G SSD | |
| Memory | 32G | |
| Processor | i5 12 generation | |
| Other Features | ||
| Door Operation | Automatic Door | |
| X-Ray Safety | <1µSv/h | |
Applications
The UNICOMP AX9600 high-power micro-focus X-ray inspection system is tailored for ultra-precision non-destructive testing of advanced semiconductor and electronic components. It excels in void ratio measurement of TVS diodes, internal defect detection of advanced IC packaging, HBM high-bandwidth memory chips, GPU modules and high-density electronic assemblies. Widely applied to quality inspection of automotive electronics, power semiconductors, aerospace electronic devices and precision micro-components, it enables accurate analysis of micro-voids, solder joint defects, internal cracks and assembly anomalies, supporting R&D verification and mass-production quality control for high-end semiconductor industries.
Inspection Images
Sample Inspection Image
Dimensions and Appearance
System Dimensions and Appearance
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee