90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP
Price:
can negotiate
MOQ:
1Set
Delivery Time:
30 days
Brand:
UNICOMP
Product Description
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP
Product Overview
The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with a multifunctional precision workstation, the system includes standard multi-axis XY motion and supports optional ±60° tilting movement for flexible multi-angle inspection. Independent Z-axis travel for both the X-ray tube and FPD enables adjustable magnification and field-of-view optimization to accommodate diverse inspection requirements.
The device integrates a precise target positioning system and an advanced DXI digital image processing platform, supporting programmable XY scanning and multi-group automatic image inspection routines to enhance testing consistency and efficiency. It offers a maximum loading area of 420mm × 420mm and a maximum effective detection area of 380mm × 380mm, delivering a system magnification of up to 300X for clear, high-precision internal defect analysis.
Key Features
- Equipped with 90kV, 5μm high-resolution X-ray tube and FPD flat-panel detector
- Multifunctional inspection workstation with standard X-Y multi-axis platform movement; ±60° arc tilt motion available as optional upgrade
- Full motion configuration: X/Y table displacement, independent Z-axis travel for X-ray tube and detector, plus optional ±60° tilting function
- Advanced multifunctional DXI digital image processing system integrated
- Supports programmable X-Y scanning to execute batches of automated image inspection sequences
- Max load dimension: 420mm × 420mm; max effective inspection area: 380mm × 380mm; system magnification up to 300X
- Built-in automatic measurement for BGA void ratio & area, with one-click inspection report output
Applications
LED, SMT, BGA, CSP, Flip Chip Inspection.
Semiconductor, Packaging components, Battery Industry.
Electronic components, Auto parts, Photovoltaic Industry.
Aluminum Die Casting, Moulding Plastic.
Ceramics, Other Special Industries
Semiconductor, Packaging components, Battery Industry.
Electronic components, Auto parts, Photovoltaic Industry.
Aluminum Die Casting, Moulding Plastic.
Ceramics, Other Special Industries
Technical Specifications
| Item | Definition | Specs |
|---|---|---|
| System Parameters | Size | 1215(L)x1325(W)x1700(H)mm |
| Weight | 1240kg | |
| Power | 220V±10% 50Hz/60Hz 4A | |
| Power Consumption | 0.8kW | |
| X-ray Tube | Type | Closed |
| Max. Voltage | 90kV | |
| Max. Power | 8W | |
| Min. Resolution | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 24" HD | |
| Geometric Magnification | 52X (Under Specific Circumstances) | |
| Detection Region | Max. Loading Size | 600mm x 520mm |
| Max. Inspection Area | 505mm x 440mm | |
| X-ray Leakage | <1μSv/h |
Inspection Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee