Unicomp AX8300 Xray Inspection Machine 110kV Sealed Tube for Wire Harness Cable
Price:
can negotiate
MOQ:
1Set
Delivery Time:
15 days
Brand:
UNICOMP
Product Description
Unicomp AX8300 X-ray Inspection Machine
Professional 110kV sealed tube X-ray inspection system designed for high-precision non-destructive testing of wire harness cables, PCBA, SMT assemblies, and electronic components.
System Overview
The Unicomp AX8300 bridges the performance gap between conventional 90kV and 130kV X-ray systems, providing optimal penetration power for comprehensive inspection without energy waste. Equipped with a high-end flat-panel detector and full 360° rotating worktable for flexible multi-angle observation.
Key Features
- 110kV Microfocus X-ray source with sealed tube design
- High resolution Flat Panel Detector (FPD)
- X/Y/Z/Tilt Motions (table, tube, FPD)
- 360° Table Rotation capability
- Angle View up to 70 Degrees
- Point and Click Location Navigation
- CNC Programming for multiple image inspection routines
- Maximum Inspection Area: 360 x 340mm
Technical Specifications
| Model | AX8300 |
| Maximum kV/Type | 110 kV/Sealed |
| Power Consumption | 900W |
| Maximum Electron Beam Power | 25W |
| Focal Spot Size | 5μm |
| Geometric Magnification | 48.8X |
| Imaging System | Flat Panel Detector |
| Door Operation | Hand-operated door |
| Monitor | 27" HD 4K Display |
| Dimensions | 1215×1325×1700mm |
| Weight | 1350kg |
| Radiation Safety | <1μSv/hr |
| Control System | Keyboard/Mouse/Joystick |
| Automated Inspection | Standard |
| Primary Applications | Chip inspection/Electronic components/Auto parts, etc. |
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
Applications
BGA/CSP/FLIP CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
QFN: Bridging, Voids, Opens, Registration
SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
QFN: Bridging, Voids, Opens, Registration
SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Radiation Safety Compliance
All Unicomp X-ray machines meet FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. Radiation emissions do not exceed 0.5 millirem/hr at 2" from any external surface, typically emitting 15 times less radiation than the standard limit.
Dimensions and Appearance
Sample Inspection Image
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee