Unicomp Technology
                                                                                                           
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24 Years
Since 2002
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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

Price Negotiable
Price: can negotiate
MOQ: 1Set
Delivery Time: 30 days
Brand: UNICOMP
Product Description
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP
This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces.
Applications
Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection molding plastic assemblies, ceramic structural components and other special industrial workpieces.
Key Features
  • Dedicated hardware configurations optimized for precision electronic inspection
  • Ultra-high 5μm detection resolution for precise capture of micro internal defects
  • Wide-coverage detection field supporting efficient batch inspection
  • High-precision dual-rocker mechanical control system for flexible positioning
  • Compatible with standard 2D flaw scanning and 2.5D contour detection
  • Expandable interfaces for 3D detection upgrade
  • Dual-screen interactive operation design for multi-task parallel operation
  • Professional AI detection algorithms for automatic identification of common internal defects
Technical Specifications
Product Name AX8300MAX
Dimension 1286(W)*1540(D)*1700(H)[mm]
Machine Weight 1530kg
Power Supply 220V±10% 50Hz/60Hz 4A
Detector High resolution FPD
Voltage 110kV
Power 900w
Tube Type Sealed
Max. Power 25W
Detection Area 129*129[mm]
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
Geometric Magnification 47.7X
Functions and Features
UNICOMP AX8300MAX X-ray inspection machine functions and features diagram
Inspection Images
Sample inspection images from UNICOMP AX8300MAX X-ray system
Dimensions and Appearance
UNICOMP AX8300MAX X-ray inspection machine dimensions and appearance
Frequently Asked Questions
What's your packaging solution? Will the equipment stay intact during transit?
All X-ray inspection systems are securely packed in standard solid wooden cases to guarantee safe transportation.
What is your warranty policy and after-sales support?
We offer a 1-year warranty covering free spare parts replacement, alongside lifetime technical support. Our dedicated after-sales team is on standby; operation tutorial videos will also be provided to resolve any operational issues.
Can we receive free training if we visit your factory?
Absolutely. You are cordially invited to our manufacturing plant, and we will arrange full free professional training for your team.
Our Services
  • Conduct project analysis and customize targeted non-destructive inspection solutions
  • Deliver full-spectrum professional testing schemes tailored to diverse industrial demands
  • Offer professional fixture customization supported by experienced engineering team
  • Provide 24-hour email response service for all client inquiries
  • Support complimentary sample inspection testing
  • Supply real-time shipment tracking & logistics information verification
  • Cover 1-year standard warranty and lifelong technical maintenance service

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Unicomp Technology
Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person James Lee

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