160kV offline Xray machine Unicomp AX9600 for PCB&BGA voids measurement and micron defects inspection
Price:
can negotiate
MOQ:
1 set
Delivery Time:
30-35 days after order confirmation
Brand:
Unicomp
Product Description
UNICOMP AX9600 160kV Offline X-ray Inspection System
High-precision microfocus X-ray machine for PCB & BGA void measurement and micron-level defect inspection in semiconductor manufacturing.
System Overview
The UNICOMP AX9600 160KV microfocus X-ray inspection system features a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. With maximum geometric magnification of 2000x and superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution for advanced IC packaging, HBM storage dies, and GPU semiconductor device quality verification.
Technical Specifications
System Summary
| Dimensions | 1690mm(L) × 2116mm(W) × 1880mm(H) |
|---|---|
| Weight | 4590kg |
| Power Supply | 220V±10% 50Hz/60Hz 9A |
| Power Consumption | 2kW |
X-ray Tube
| Tube Type | Open Type |
|---|---|
| Voltage | 160kV |
| Max. Power | 64W |
| Min. Resolution | 1µm |
Imaging System
| X-ray Detector | FPD |
|---|---|
| Pixel Size | 84µm |
| Detection Area | 129 × 129mm |
| Pixel Matrix | 1536 × 1536 pixel |
| Frame Rates | Max 30fps |
| System Magnification | 34000X |
Motion Control System
| Max. Payload Size | 520 × 520mm |
|---|---|
| Max. Detection Size | 520 × 520mm |
| X/Y/Z-Axis Travel Distance | 550/710/265mm |
| Tilt and Rotation | Detect XY±70° Tilt |
Industrial PC
| Motion Control Mode | 34"HD 4K curved display |
|---|---|
| Operating System | Windows 11 64-bit |
| Storage | 4TB HDD + 512G SSD |
| Memory | 32G |
| Processor | i5 12 generation |
Safety Features
| Door Operation | Automatic Door |
|---|---|
| X-Ray Safety | <1µSv/h |
Applications
The UNICOMP AX9600 high-power microfocus X-ray inspection system is engineered for ultra-precision non-destructive evaluation (NDE) of advanced semiconductors and microelectronic components. It delivers high-fidelity void fraction quantification for TVS diodes, alongside internal flaw inspection for advanced IC packages, HBM high-bandwidth memory dies, GPU modules and high-density electronic assemblies.
Extensively deployed for quality validation across automotive electronics, power semiconductors, aerospace-grade electronic hardware and miniature precision components, the system facilitates precise characterization of micro-voids, solder joint anomalies, internal fractures and assembly irregularities. It provides robust technical backing for R&D validation and mass production process quality control within the high-end semiconductor manufacturing sector.
Inspection Images
Sample Inspection Image
System Dimensions and Appearance
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee