2D/2.5D/3D All‑in‑One Imaging 160kV Open Tube Semiconductor BGA AX9500 Unicomp Post‑rework PCBA QC Scanner
Price:
can negotiate
MOQ:
1Set
Delivery Time:
30 days
Brand:
UNICOMP
Product Description
AX9500 UNICOMP X-Ray Computed Tomography System
High-precision 2D/2.5D/3D all-in-one imaging system for accurate PCB and BGA inspection with 160kV open tube technology.
Advanced Inspection Capabilities
Fully upgraded system capable of CT detection on BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis and 3D tomography CT scanning (planar CT + cone beam CT).
Industry Applications
- Semiconductor manufacturing
- SMT assembly processes
- Photovoltaic industry
- Ceramic products and specialized industries
- Automotive parts inspection
- Aluminum die-casting mold castings
- Molded plastic components
System Specifications
| System Summary | |
|---|---|
| Footprint | 1580(W) × 1860(D) × 2000(H) mm |
| Machine Weight | ≈3750 kg |
| Power | 4.5 kW |
| Max. Voltage | 160 kV |
| X-Ray Leakage | <0.5 μSv/h |
| Imaging System | |
|---|---|
| Tube Type | Open tube |
| Resolution | 1 μm (Optional 0.5 μm) |
| Detector | FPD |
| System Magnification | 2000X |
| Inspection Area | |
|---|---|
| Max. Inspection Dimension | 610 × 540 mm |
| Max. Load Dimension | 610 × 580 mm |
| Max. Inspection Area (3D) | Planar 3D: 450(X) × 450(Y) mm Cone-beam 3D: 50(D) × 150(L) mm |
| Motion Control Mode | Joystick, Mouse & Keyboard |
| Detector Angle | 360° full viewing angle, 2×70 degree tilt |
X-Ray Inspection Sample
Specifications are subject to change without notice. All trademarks are the property of the system maker.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Unicomp Technology
Location
Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person
James Lee