EMS Semiconductor BGA X Ray Inspection Machine System AX8200 0.8kW Power Consumption
EMS Semiconductor BGA X Ray Inspection Machine System AX8200
Features:
● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera.
● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement.
● Multi-function DXI image processing system
● X/Y programming function for multiple image inspection routines
● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.
Item | Definition | Specs |
System Parameters | Size | 1080(L)x1180(W)x1730(H)mm |
Weight | 1150kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.8kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 90kV/100kV | |
Max.Power | 8W | |
Spot Size | 5μm | |
X-ray System | Intensifier | 4"Image Intensifier |
Monitor | 22"LCD | |
System Magnification | 600x | |
Detection Region | Max.Loading Size | 510mm x 420mm |
Max.Inspection Area | 435mm x 385mm | |
X-ray Leakage | < 1uSv/h | |
Full Automatic BGA Testing Procedures
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving
NC Programming
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time
6.Anti-collision system can meet the maximum tilt and observe objects
Inspection Images:
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