Electronic Semiconductor X-Ray Inspection Equipment AX7900

The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent detection accuracy, convenient operation and compliant safety performance, it can satisfy mass and customized inspection demands of SMT/PCBA, semiconductor, lithium battery, photovoltaic and other industries.

Emission: Extremely low radiation dose adhering to all International Safety Standards.

Environment: New advanced lead curtain pressure membrane technology effectively eliminating secondary lead (Pb) pollution.

Power: Penetration equivalence of up to a 34mm steel plate.

Operation: Intuitive operator interface and media interface for quick learning and optimization of the machine.

Software/Imaging: Robust software platform with intuitive control interface. Clean and crisp image presentation meeting all International Standards.

Traceability: Cutting edge Cloud traceability functions from initial product scan to final customer acceptance ensuring full safety throughout the process.

Support: A full suite of customer support including; remote technical support, direct access to the Cloud, and real time monitoring of machine technical functions/operation.