High Accuracy Internal Defect Scan Lithium Battery Safety Inspection Battery X-ray AX9600 Unicomp New Energy Testing Instrument
High Accuracy Internal Defect Scan Lithium Battery Safety Inspection Battery X-ray AX9600 Unicomp New Energy Testing Instrument
Product Positioning:
AX9600 is Unicomp Technology's most sophisticated semiconductor X-ray inspection equipment. Its core value lies in being equipped with the self-developed 160kV open micro-focus X-ray source, which has broken overseas monopoly. It is strategically positioned as inspection equipment for AI computing power chips and advanced packaging, and has been awarded the EM Innovation Award and the Advanced Manufacturing Innovation Achievement Award.
AX9600 is Unicomp's flagship open tube X-ray inspection system, designed for high-end semiconductor and advanced packaging applications where nanoscale resolution is critical.
Choose AX9600 if you need:
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Sub-micron (0.8μm) defect detection for HBM/GPU/AI chips
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Open tube technology with self-developed 160kV source
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AI-powered automated inspection with 2000% efficiency gain
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3D advanced packaging (TSV/TGV/3D-SiP) capability
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Third-generation semiconductor (SiC/GaN) inspection
Specifications:
| System Summary | Dimensions | 1655mm(L)×2100mm(W)×1880mm(H) |
| Weight | 4590kg | |
| Power Supply | 220V±10% 50Hz/60Hz 9A | |
| Power Consumption | 2kw | |
| X-ray Tube |
Tube Type | Open Type |
| Voltage | 160kv | |
| Max.Power | 64W | |
| Focus Spot Size | 1µm | |
| Imaging System | X-ray Detector | FPD |
| Pixel Size | 84µm | |
| Detection Area | 129*129mm | |
| Pixel Matrix | 1536*1536[pixel] | |
| Frame Rates | Max30fps | |
| System Magnification | 34000X | |
| Motion control system | Max. Payload size | 520*520[mm] |
| Max.Detection size | 520*520[mm] | |
| X/Y/Z-Axis Travel Distance(mm) | 550/710/265[mm] | |
| Tilt and Rotation | Detect XY±70° Tilt | |
| Industrial PC | Motion Control Mode | 34"HD 4K curved display |
| Max.Payload Size | Windows 11 64-bit | |
| Max.Detection Size | 4TB HDD+512G SSD | |
| X/Y/Z-axis travel distance(mm) | 32G | |
| Tilt and Rotation | i5 12 generation | |
| Other | Door Open | Automatic Door |
| X-Ray Safety | ＜1µSv/h |
FAQ:
Q1: What makes AX9600 different from other X-ray inspection systems?
The AX9600 features Unicomp's self-developed 160kV open microfocus X-ray source —the first domestically produced open tube in China. It achieves 0.8μm nanoscale resolution and 2000X magnification, breaking foreign monopoly in this technology.
Q2: What semiconductor components can the AX9600 inspect?
The system is optimized for HBM, GPU, and AI computing chips, 3D and SiP advanced packaging, TSV/TGV interconnects, and third-generation semiconductors (SiC, GaN). It detects wafer-level and chip-level defects including voids, cracks, bridges, delamination, and solder issues.
Q3: Does the AX9600 use AI for inspection?
Yes. The AX9600 features AI-powered automatic defect measurement with 0.8-second fast analysis per point, achieving 2000% efficiency improvement over manual inspection. It also includes AI super-resolution image restoration and HDR image optimization.
Q4: Has the AX9600 won any industry awards?
Yes. The AX9600 won the EM Innovation Award in March 2026 and the Advanced Manufacturing Innovation Achievement Award in 2025, recognizing its breakthrough contributions to semiconductor quality control.
Q5: What is the advantage of an open tube X-ray source?
Open tube technology provides smaller focal spot (0.8μm), higher voltage capability (160kV) , and better resolution compared to closed tubes. It allows nanoscale imaging essential for detecting defects in advanced semiconductor packaging and AI chips
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