Unicomp Technology
                                                                                                           
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High Resolution Defect Detection Reliable IC Internal Inspection PCBA IC X-ray AX9600 Unicomp

Price Negotiable
Price: can negotiate
MOQ: 1Set
Delivery Time: 30 days
Brand: UNICOMP
Product Description

High Resolution Defect Detection Reliable IC Internal Inspection PCBA IC X-ray AX9600 Unicomp


Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm.

Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes.

It is specially optimized for high-precision non-destructive inspection of advanced IC packaging, HBM high-bandwidth memory and GPU semiconductor core components.



Specifications:


System Summary Dimensions 1655mm(L)×2100mm(W)×1880mm(H)
Weight 4590kg
Power Supply 220V±10% 50Hz/60Hz 9A
Power Consumption 2kw
X-ray Tube

Tube Type Open Type
Voltage 160kv
Max.Power 64W
Focus Spot Size 1µm
Imaging System X-ray Detector FPD
Pixel Size 84µm
Detection Area 129*129mm
Pixel Matrix 1536*1536[pixel]
Frame Rates Max30fps
System Magnification 34000X
Motion control system Max. Payload size 520*520[mm]
Max.Detection size 520*520[mm]
X/Y/Z-Axis Travel Distance(mm) 550/710/265[mm]
Tilt and Rotation Detect XY±70° Tilt
Industrial PC Motion Control Mode 34"HD 4K curved display
Max.Payload Size Windows 11 64-bit
Max.Detection Size 4TB HDD+512G SSD
X/Y/Z-axis travel distance(mm) 32G
Tilt and Rotation i5 12 generation
Other Door Open Automatic Door
X-Ray Safety <1µSv/h



Inspection Images:

Dimensions and Appearance:


Application Areas:

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Company Unicomp Technology
Location Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact Person James Lee

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