Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection.
As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts.
| System Summary | Dimension | 1215(W)∗1325(D)∗1700(H)mm |
| Machine Weight | 1350kg | |
| Power Supply | 220V±10% 50Hz/60Hz 4A | |
| Power Consumption | 900W | |
| X-Ray Tube | Tube Type | Sealed |
| Voltage | 110kV | |
| Max.Power | 25W | |
| Min.Resolution | 5µm | |
| Other Features | X-Ray Safety | <1µSv/h |
Major applications:
PCBA BGA/IC LED Aliminum die casting Battery connector inspecting
1. Semiconductor package
2. Electronic connector module.
3. Original Package
4. Aerospace components
5. Medical appliances
6. Automation components
Application:
1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2. QFN:Bridging,Voids,Opens,Registration
3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images
Application Fields
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