Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection

Description of BGA X-Ray machine AX7900:

Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI image software, it supports XY programming for batch inspection routines. Max loading area 420×420mm, max detection area 380×380mm, system magnification up to 300X.

APPLICATION of IC Xray machine AX7900:

• LED, SMT, BGA, CSP, Flip Chip Inspection.
• Semiconductor, Packaging components, Battery Industry.
• Electronic components, Auto parts, Photovoltaic Industry.
• Aluminum Die Casting, Moulding Plastic.
• Ceramics, Other Special Industries

FEATURES of IC Xray machine AX7900:

• 90KV 5μm X-ray tube, FPD Detector.
• Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
• Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
• Multi-function DXI image processing system.
• X/Y programming function for multiple image inspection routines
• Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
• BGA void/area auto-measurement plus report generation.

Technical Specifications of AX7900

Inspection Images of IC X-Ray machine AX7900:

Application Fields

Dimensions and appearance