TUV Approved Low Profile 1608 Metric POLY-FUSE SMD Surface Mountable PTC Resettable Fuse EIA 0603 6V 500mA
TUV Approved Low Profile 1608 Metric POLY-FUSE SMD Surface Mountable PTC Resettable Fuse EIA 0603 6V 500mA
Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 500mA
(e) Maximum Voltage: 6VDC
(f) Temperature Range : -40℃ to 85℃
Agency Recognition
TUV
UL
CSA
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Working Principle
FSMD Series PTC provides surface mount overcurrent protection for applications where space is at a premium and resettable protection is desired.
Electrical Characteristics (23℃)
| P/N | (A) | (A) | (V) | (A) | Max. Trip | (W) | (Ω) | ||
| IH | IT | Vmax | Imax | (A) | (Sec.) | Pd typ | Rmin | R1max | |
| FSMD010 | 0.10 | 0.30 | 15 | 40 | 0.50 | 1.00 | 0.50 | 0.90 | 6.00 |
| FSMD020 | 0.20 | 0.50 | 9 | 40 | 1.00 | 0.60 | 0.50 | 0.55 | 3.50 |
| FSMD035 | 0.35 | 0.75 | 6 | 40 | 8.00 | 0.10 | 0.50 | 0.20 | 1.40 |
| FSMD050 | 0.50 | 1.00 | 6 | 40 | 8.00 | 0.10 | 0.50 | 0.10 | 0.80 |
H=Hold current-maximum current at which the device will not trip at 23℃still air.
IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin
Dimension (Unit:mm)
| P/N | Marking | A | B | C | D | |||||||
| Min. | Max. | Min. | Max. | Min. | Max. | Min. | ||||||
| FSMD010 | 1 | 1.45 | 1.85 | 0.65 | 1.05 | 0.30 | 0.65 | 0.20 | ||||
| FSMD020 | 2 | 1.45 | 1.85 | 0.65 | 1.05 | 0.30 | 0.65 | 0.20 | ||||
| FSMD035 | 3 | 1.45 | 1.85 | 0.65 | 1.05 | 0.30 | 0.65 | 0.20 | ||||
| FSMD050 | 5 | 1.45 | 1.85 | 0.65 | 1.05 | 0.65 | 1.00 | 0.20 | ||||
Material Specification
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
Thermal Derating Curve
Typical time to trip at 25℃
The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables.
Thermal Derating Chart – I hold (Amps)
| P/N | Ambient Operating Temperature | ||||||||
| -40℃ | -20℃ | 0℃ | 25℃ | 40℃ | 50℃ | 60℃ | 70℃ | 85℃ | |
| FSMD010 | 0.13 | 0.12 | 0.11 | 0.10 | 0.08 | 0.07 | 0.06 | 0.05 | 0.03 |
| FSMD020 | 0.27 | 0.25 | 0.23 | 0.20 | 0.17 | 0.14 | 0.12 | 0.10 | 0.07 |
| FSMD035 | 0.47 | 0.41 | 0.38 | 0.35 | 0.29 | 0.26 | 0.24 | 0.20 | 0.14 |
| FSMD050 | 0.67 | 0.59 | 0.54 | 0.50 | 0.41 | 0.37 | 0.34 | 0.29 | 0.20 |
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