1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equipment

Application: Small Motor System, Portable Electronics Device, Input Power Port, Test Equipment

Features

a. High voltage and high current rating
b. High inrush and high breaking capacity
c. Fast arcing extinguished
d. Lead free & Halogen free material
e. Good explosion proof
f. Precise fusing time and cut-off completed
g. Suitable for rated current of 1A ~8A

h.Approval UL Recognized 1A~8A

i. Interrupting Rating 60 amperes at 32V DC

j. Soldering method :*Reflow Soldering : 260°C, 30Sec. max.*Wave Soldering : 260°C, 10Sec. max. *Hand Soldering : 350°C, 3Sec. max.

Environmental Specification

Operating Temperature -55°C to +125°C

Vibration MIL-STD-202G, Method 201(10-55 Hz, 0.06 inch, total excursion)

Salt Spray MIL-STD-202G, Method 101, Test Condition B (48Hrs)

Insulation Resistance MIL-STD-202G, Method 302, Test Condition A

Resistance to Solder Heat MIL-STD-202G, Method 210, Test Condition B (10sec, at 260°C)

Thermal Shock MIL-STD-202G, Method 107, Test Condition B (-65°C to +125°C)

Size

Specification

1.Measured at ≦ 10% of rated current and 25°C.

2.Melting I2 t at 1000% of current rating.

Electrical Characteristic

Physical Specification

Material

Construction Body Material: Ceramic

Termination Material: Silver(Ag),Nickel(Ni),Tin(Sn)

Fuse Element: Silver(Ag)

Packaging

1. Tape & Reel : 8mm tape

2. Packaging Specification : EIA Standard 481-D

3.Quantity : 4,000 pcs per reel.