Anti Interface FPC Flexible Printed Circuit Board For Camera Or Mobile Device

Price Negotiable

Price: Negotiable

MOQ: 500 pcs/ lot

Delivery Time: 12-15 working days afer sample approval

Brand: Wenyi Electronics

Product Description

Item decription:

Anti- interface EMI Shield Mobile Device Camera Use FPC flexible printed circuit

Material: Polymide, SUS 304 Steel sheet,

Cover film: PI cover film

Type: EMI Shield Anti- interface

Copper : 0.5 OZ

Finger Pitch: 1 mm gold finger

Stiffener: PI

Thickness: 0.27mm -0.36mm.

Business Terms:

MOQ : 500 pcs/ lot

Sample lead time: 8-12 working days

Mass production lead time: 10-14 working days , as per order Qty.

Our Advantage:

Application:

Technical specification:

FPC Manufacturing Capability	Technical Performance Data
Layers Qty	1 - 8 layers
Finished FPC Size	Min.:4x4mm Max.:250x1200mm
FPC Board Thickness:	0.08-0.12mm for single layer, 0.12-0.22mm for double layer
Stiffener Material Choice	PI.PET,FR4-PI
Pitch of the Pin	0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mm
Finished Board Thickness Tolerance	±0.03mm
Finished hole diameter(Min.)	0.15mm
Finished hole diameter(Max)	0.6mm
NPTH Hole diameter tolerance	±0.025mm
PTH hole diameter tolerance	±0.050mm
Copper foil thickness	18um,35um,70um/
Circuit width/spacing(Min.)	≥0.065mm(1/2oz)≥0.05mm(1/3oz)
Surface Finished type	OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc
Gold Flash Ni/Au thickness	Ni:2.54-9um Au:0.025-0.5um
Immersion Tin thickness	0.7-1.2um
Tin plating thickness	3-15um
Drill hole position tolerance	±0.05mm
Punching dimension tolerance	±0.05mm
Certificate	ROHS,UL,ISO9001 SGS, etc