ASTM B387 Molybdenum Machined Parts Ion Injection Parts For Semiconductors

ASTM B387 High Precision Molybdenum Ion Injection Parts for Semiconductors

In the field of semiconductors, IC (integrated circuit), also known as chip, occupies an important position.
A key technique in chip manufacturing is called ion implantation (doping), which aims to obtain specific electrical conductivity properties.
Ion sources used to emit ion beams are made of tungsten and molybdenum materials and are often delivered in a polished state.
Our polished tungsten and molybdenum plate is of stable quality and large sales volume, which is one of the core products of the company.

Detection ability
Here we can test density, hardness, surface roughness, grain size, tensile strength and other parameters of our products. With special equipments we can precisely get the overall density of the large crucibles, which may reflect the real performance of the crucible. . The possible hidden factory of crucible such as porosity, slag, cracks and other injuries are doubly strictly inspected with eddy current and ultrasonic equipments by us to ensure the quality of our sintered.