Molybdenum Copper Alloy Sheets Mo60Cu40 Powder Metallurgy
Molybdenum Copper Alloy Sheets Mo60Cu40 Foil Plate on Sale
Molybdenum Copper Alloy Discription
Molybdenum copper alloy is used as heat sink material due to its high thermal conductivity. The properties of the two alloys are similar, and the density of molybdenum copper alloy is less than that of tungsten copper alloy. The preparation of molybdenum copper alloy mainly adopts the melt immersion method, using high-quality molybdenum powder and oxygen free copper powder, and applying isostatic pressing molding (high-temperature sintering copper infiltration), with fine structure, good arc breaking performance, good electrical conductivity, good thermal conductivity and small thermal expansion.
Applications of Molybdenum Copper Alloy
Radiator microwave carrier
Microelectronic packaging substrate and shell
Ceramic carrier
GaAs and silicon device base laser diode base surface mount encapsulated conductor microprocessor cover
| Grade | Mo(wt%) | Cu (wt%) | Density (g/cm3) | Thermal Conductivity (W/(M.K) | Thermal Expansivity (10-6/K) |
| Mo85Cu15 | 85+/-1 | Balance | 10 | 160-180 | 6.8 |
| Mo80Cu20 | 80+/-1 | Balance | 9.9 | 170-190 | 7.7 |
| Mo70Cu30 | 70+/-1 | Balance | 9.8 | 180-200 | 9.1 |
| Mo60Cu40 | 60+/-1 | Balance | 9.66 | 210-250 | 10.3 |
| Mo50Cu50 | 50+/-1 | Balance | 9.54 | 230-270 | 11.5 |
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