Module Hermetically Sealed Electronic Packages
Price:
Negotiable
MOQ:
50 PCS
Delivery Time:
30 Days
Brand:
JOPTEC
Product Description
Main performance parameters
- Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator
- Lead welding method: tin welding, gold wire bonding
- Nickel layer thickness: >3μm
- Gold layer thickness:> 0.45μm
- Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He)
- Insulation resistance: ≥1000MΩ (DC500V)
- material:
- Base: Kovar alloy, iron-nickel alloy, copper
- Ring frame: Kovar alloy, steel
- Lead: Kovar alloy, iron-nickel alloy, copper core composite
- Cover plate: Kovar alloy, iron-nickel alloy, steel
- Insulator: DM308 or similar, iron sealed glass beads, ceramic
- Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding
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Company
JOPTEC LASER CO., LTD
Location
No.451 Huangshan Road, Hefei, Anhui, China
Contact Person
JACK HAN