Components Hermetically Sealed Electronic Packages
Price:
Negotiable
MOQ:
50 PCS
Delivery Time:
30 Days
Brand:
JOPTEC
Product Description
Main performance parameters
Application fields: optical communication module package
Lead welding method: tin welding, gold wire bonding
Nickel plating thickness: >3μm
Gold plating thickness: >0.45μm
Hermeticity: Leak rate ≤1x10-3Pa.cm3/s (He)
Material:
Shell: Kovar Alloy, copper, aluminum, steel, etc.
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron-sealed glass beads
Sealing process and technology: parallel seam welding, laser welding
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Company
JOPTEC LASER CO., LTD
Location
No.451 Huangshan Road, Hefei, Anhui, China
Contact Person
JACK HAN