Product name: infrared detector package

Applications: infrared detectors


Product features: The infrared detector package can provide high-reliability and airtight packaging for refrigerated and uncooled infrared detectors. The main package forms are butterfly ceramic package, ceramic PGA package and ring ceramic package, which can integrate fusion sealing, brazing, HTCC multilayer ceramic and light window technology.

Technical characteristics:

Substrate material: Kovar (4J29), Aluminum oxide ceramics, aluminum nitride ceramics

Lead material: Kovar

Processes: Silver gold brazing, gold tin soldering, HTCC multilayer

Insulation resistance: ≥ 1x10¹⁰Ω (500V DC)

Air tightness: ≤1x10^-6Pa.cm³/s (He)

Plating: Full plating gold or lead plating gold, partial plating, etc.

Reliability: Meets MIL-883 and GJB5438 requirements