Product name: TO and SMD type packages for transistor device

Applications: automatic control of machinery and electrical appliances in the fields of home appliances, automobiles, ships, motor cars, power electronics, etc.

Product characteristics: The external dimensions meet the JEDE standard, and the glass or ceramic air-tight connection is used. It is suitable for insertion and surface mounting. Parallel seam welding or energy storage welding can be used for cover (cap) sealing , the surface is nickel-plated and gold-plated, differential plating areas, differential gold and nickel plating thickness, good heat dissipation, good hermeticity and high reliability.

Technical characteristics

Base material: Low carbon steel, Kovar ceramic, tungsten copper, etc.

Lead material: Kovar, Kovar copper, copper alloy, etc.

Thermal conductivity of base plate: ＞150W/m.K

Air tightness: ≤1x10^-3Pa.cm³/s (He)

Plating: Ni/Au

Reliability: Meets MIL-883 requirements