HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China FCCSP Package Substrate Manufacturing - 1 mil Line Width, 0.3mm Thickness, 1-6 Layer Custom IC Packaging for sale

FCCSP Package Substrate Manufacturing - 1 mil Line Width, 0.3mm Thickness, 1-6 Layer Custom IC Packaging

Price Negotiable
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
FCCSP Package Substrate Manufacturing
HOREXS-Hubei specializes in high-precision FCCSP (Flip Chip Chip Scale Package) substrate manufacturing with advanced technical capabilities for semiconductor packaging applications.
Applications
FCCSP package, IC assembly, semiconductor packaging, consumer electronics, computers, and other advanced electronic applications.
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.3mm
Copper Thickness 10-15μm or Customized
Layer Count 1-6 layers (Customized)
Surface Finish Mainly immersion gold, supports OSP/immersion silver, tin, and other custom options
Soldermask Green or customized (Brands: TAIYO INK, ABQ)
Material Brands
SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Manufacturing Capabilities
Advanced Process Technologies
  • Fine pattern by MSAP (20/20μm) and Tenting (30/30μm)
  • Thin Core Technology
  • All type Surface Finish options
  • SR Flatness Process, Build up / Via Filling Technology
  • Tailless, Etch-back Process
  • Fine Pitch SOP process
Technical Support
  • Wire bonding substrate (BGA)
  • Embedded (Memory IC substrate)
  • MEMS/CMOS, Module (RF, Wireless, Bluetooth)
  • 2/4/6L (1+2+1/2+2+2/1+4+1)
  • Buildup (Buried/Blind hole) Flipchip CSP
  • Other ultra IC package substrate solutions
Company Overview
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual IC substrate capacity of 600,000 SQM with Tenting & SAP processes.
Inquiry Requirements
For accurate quotations, please provide:
  • Substrate production specification information
  • Gerber files and drilling files
  • Quantity requirements including samples
  • For multilayer substrates: layer stack-up/build-up information
Shipping Options
DHL, UPS, FedEx, air freight, and customized express services.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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