HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
Verified Supplier
16 Years
Since 2010
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Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
Microelectronics Package Substrate Manufacturing
Applications
  • IC Package
  • Semiconductor Package
  • Memory Electronics
  • NAND/Flash Memory
  • Microelectronics Assembly
  • Microelectronics Package
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Copper Weight 0.5oz or Customized
Layers 1-6 Layers (Customized)
Soldermask Green or Customized (TAIYO INK, ABQ)
Material Brands
Main brands: SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finishes
Mainly immersion gold, supports customization including OSP/Immersion silver, tin, and more
Manufacturing Capabilities
HOREXS Manufacturing Facility
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD.
Production Capacity
Annual IC Substrate Capacity: 600,000 SQM/year
Process Technologies: Tenting & SAP Process
Advanced Technology Capabilities
  • Line/Space: 20/20μm, 10/10μm
  • Materials: BT+ABF
  • Wire Bonding Substrate (BGA)
  • Embedded Memory IC Substrate
  • MEMS/CMOS, Module (RF, Wireless, Bluetooth)
  • 2/4/6 Layer Structures (1+2+1/2+2+2/1+4+1)
  • Buildup (Buried/Blind Hole) Flipchip CSP
  • Other Ultra IC Package Substrate Technologies
Inquiry Requirements
Required Information for Quotation
  1. Substrate production specification information
  2. Gerber files and drilling files
  3. Quantity requirements including samples
  4. For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
Supported shipping methods: DHL, UPS, FedEx, Air Freight, Custom Express Services
Contact HOREXS Today
For better pricing and superior quality IC substrates, contact HOREXS now. We provide technical support and cost-saving solutions while maintaining high quality standards.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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