Wire Bonding Memory Substrate with Soft Gold Plating - 0.22mm Thickness, 25μm Line Width, 1-6 Layers
Price:
US 0.89-1.09 each piece
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Product Overview
High-performance wire bonding packaging memory substrate featuring soft gold plating for superior connectivity and reliability in advanced semiconductor applications.
Applications
- IC Package & Semiconductor Packaging
- Memory Electronics (NAND/Flash Memory)
- UDP/USB Memory Products
- Other Advanced Memory Applications
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.22mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 1-6 Layers (Customizable) |
| Surface Finish | Immersion Gold (Custom options: OSP, Immersion Silver, Tin) |
| Soldermask | Green or Custom Colors (Brands: TAIYO INK, ABQ) |
Material Options
Premium material brands including SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Manufacturing Capabilities
HOREXS-Hubei Facility: 60,000 square meters production area with $300 million USD investment
Annual Capacity: 600,000 SQM of IC Substrate
Advanced Technology: L/S 20/20μm, 10/10μm capability
Material Expertise: BT+ABF materials and advanced build-up processes
Inquiry Requirements
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
Shipping & Support
Global shipping via DHL, UPS, FedEx, and air freight options available.
Technical support and cost-saving solutions for high-volume customers.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu