AUS308 PSR IC Package Substrate - 1mil Line Width, 0.22mm Thickness for Memory Cards & Semiconductor Packaging
The AUS308 PSR IC Package substrate is engineered for high-performance semiconductor packaging applications, supporting memory cards, wearable electronics, and advanced IC assemblies with precision manufacturing capabilities.
- UDP memory cards, TF cards, SD cards
- IC substrate PCB boards
- Semiconductor packaging and assembly
- Wearable electronics
- NAND/Flash memory packaging
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.22mm |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 4 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (Customizable: OSP, immersion silver, tin) |
| Soldermask | Green (Customizable, TAIYO INK brand) |
HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with over $300 million USD investment. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes. Advanced technology supports line/space down to 10/10μm with BT+ABF materials.
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer buildup structures with buried/blind vias
- Flipchip CSP packaging
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for large-volume customers with cost-saving solutions and quality guarantees.
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