0.26mm Memory IC Substrate with 25μm Line Width and Soft Gold Plating for Semiconductor Packaging
Price:
US 0.12-0.15 each piece
MOQ:
1000pieces
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
0.26mm Memory Substrate with Soft Gold Plating
Product Applications
- IC Package Substrates
- Semiconductor Packaging
- Memory Electronics
- NAND/Flash Memory Applications
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.26mm |
| Copper Weight | 0.5oz or Customizable |
| Layer Count | 1-6 Layers (Customizable) |
| Surface Finish | Immersion Gold (Standard), OSP, Immersion Silver/Tin (Customizable) |
| Soldermask | Green (Standard), Custom Colors Available (TAIYO INK, ABQ Brands) |
Material Options
Primary Brands: SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others available upon request.
Manufacturing Capabilities
- Advanced Line/Space Technology: 20/20μm, 10/10μm
- BT+ABF Material Processing
- Wire Bonding Substrates (BGA)
- Embedded Memory IC Substrates
- MEMS/CMOS, RF/Wireless/Bluetooth Modules
- 2/4/6 Layer Build-up Structures (1+2+1/2+2+2/1+4+1)
- Flipchip CSP Technology
- Annual Production Capacity: 600,000 SQM
Inquiry Requirements
- Complete substrate production specifications
- Gerber files with drilling data
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
Shipping & Support
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for high-volume customers.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu