HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China NAND Memory Package Substrate Manufacturing - 1mil Line Width, 0.24mm Thickness, 1-6 Layer Custom IC Boards for sale
China NAND Memory Package Substrate Manufacturing - 1mil Line Width, 0.24mm Thickness, 1-6 Layer Custom IC Boards for sale
China NAND Memory Package Substrate Manufacturing - 1mil Line Width, 0.24mm Thickness, 1-6 Layer Custom IC Boards for sale

NAND Memory Package Substrate Manufacturing - 1mil Line Width, 0.24mm Thickness, 1-6 Layer Custom IC Boards

Price Negotiable
Price: USD 0.098-0.109 each piece
MOQ: 5000pieces
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
NAND Memory Package Substrate Manufacturing

Advanced IC substrate solutions for NAND memory packages, flash memory, and semiconductor applications with precision manufacturing capabilities.

Applications
  • NAND memory package substrates
  • Memory and storage electronics
  • Flash memory applications
  • FBGA/PBGA semiconductor packaging
PCB Production Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.24mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (standard), OSP, immersion silver, tin, custom options
Copper Weight 0.5oz or customizable
Layer Count 1-6 layers (customizable)
Soldermask Green standard, customizable (TAIYO INK, ABQ brands)
Manufacturing Capabilities

HOREXS-Hubei Facility: 60,000 square meters production area with $300 million USD investment

Annual Capacity: 600,000 SQM IC substrates

Advanced Technology: L/S 20/20μm, 10/10μm capabilities

Material Expertise: BT+ABF materials processing

Supported Applications: Wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/Bluetooth modules

Inquiry Requirements
  • Substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up/build-up information for multilayer substrates
Shipping & Logistics

Global shipping support via DHL, UPS, FedEx, and air freight with customized express options.

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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