0.28mm Lead Free Memory Chip Substrate - 25μm Line Width, 1-6 Layer Custom IC Package Manufacturing
IC package, Semiconductor package, Memory electronics, NAND/Flash memory applications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.28mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 1-6 Layers (Customizable) |
| Surface Finish | Mainly immersion gold, supports OSP/immersion silver, tin, and other custom options |
| Soldermask | Green or Customized (Brands: TAIYO INK, ABQ) |
SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others
HOREXS-Hubei, part of HOREXS Group, is a leading and rapidly growing IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD.
Annual Capacity: 600,000 SQM/year using Tenting & SAP processes
Advanced Technology: L/S 20/20μm, 10/10μm, BT+ABF materials
Supported Applications: Wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, RF/wireless/Bluetooth modules, 2/4/6 layer builds with buried/blind vias, Flipchip CSP, and other ultra IC package substrates
For accurate quotation and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files (exported from layout software)
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
DHL, UPS, FedEx, Air freight, and customized express services
Looking for better pricing and superior quality IC substrates?
Contact HOREXS today for competitive pricing and technical support. Our mission is to help you save costs while maintaining high quality standards.
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