HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China Ultrathin Rigid IC Substrate PCB - 0.2mm Thickness, 10/10μm Line Width, 2-Layer Microelectronics Assembly for sale
China Ultrathin Rigid IC Substrate PCB - 0.2mm Thickness, 10/10μm Line Width, 2-Layer Microelectronics Assembly for sale
China Ultrathin Rigid IC Substrate PCB - 0.2mm Thickness, 10/10μm Line Width, 2-Layer Microelectronics Assembly for sale

Ultrathin Rigid IC Substrate PCB - 0.2mm Thickness, 10/10μm Line Width, 2-Layer Microelectronics Assembly

Price Negotiable
Price: US 150-180 per square meter
MOQ: 100pieces
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
IC substrates are specialized carrier materials for integrated circuits that provide internal circuitry to connect chips with PCB boards. These substrates protect circuits and specialized lines while offering superior heat dissipation and serving as standardized modules for IC components. They are essential materials for memory IC packaging applications.
Applications
  • DRAM memory electronics
  • MicroSD and MicroTF cards
  • Semiconductor packaging
  • SD cards and memory cards
  • MEMS/CMOS modules
Technical Specifications
Parameter Specification
Minimum Line Space/Width 35/35μm - 20/20μm - 10/10μm
Finished Thickness 0.2mm
Copper Thickness 12μm
Layers 2 layers
Raw Materials SHENGYI, Mitsubishi, mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish ENIG, ENEPIG, OSP, Soft Gold, Hard Gold
Soldermask/PSR Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series
Manufacturing Capabilities
HOREXS Group operates two manufacturing facilities with a combined annual IC substrate capacity of 600,000 square meters. The company specializes in advanced manufacturing technologies including line/space capabilities down to 10/10μm and supports various IC packaging formats including BGA, CSP, and embedded memory substrates.
Production Capacity
Monthly Output: 65,000 square meters combined across both facilities
Technology: Tenting & SAP processes
Materials: BT+ABF materials support
Quotation Requirements
  • Gerber files
  • Production specifications
  • Buildup/stackup information for multilayer substrates
  • Additional supporting documentation
Shipping Options
DHL, UPS, FedEx services available via air freight, sea freight, or customized express shipping arrangements.
Contact Information
Contact Person: AKEN
Email: akenzhang@horexspcb.com
Support: Technical roadmap files, design rules, and production capability documentation available upon request.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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