0.15mm Gold Finger SD Card IC Substrate PCB - 10/10μm Line Width, 0.2mm Thickness for Memory Electronics
Price:
US 160-175 per square meter
MOQ:
10 squre meters
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
IC Substrate PCB Overview
IC substrate PCBs serve as essential carrier materials for memory integrated circuits, featuring internal circuitry that connects chips to PCBs. These substrates provide circuit protection, specialized line routing, optimized heat dissipation, and standardized IC component modules. As a critical material in memory IC packaging, IC substrates play a vital role in semiconductor manufacturing.
Applications
- DRAM memory electronics
- MicroSD and MicroTF cards
- Semiconductor packaging
- IC package substrates
- SD cards and memory cards
PCB Production Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.2mm |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG, ENEPIG, OSP, Soft Gold, Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 layers |
| Soldermask/PSR | Green Taiyo brand, AUS 308, AUS 320, AUS 410, SR-1700, 300 series |
Manufacturer Profile
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters utilizing tenting and SAP processes. The company specializes in advanced technologies including L/S 20/20μm and 10/10μm capabilities with BT+ABF materials.
Technical Capabilities
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and other ultra IC package substrates
Frequently Asked Questions
Company Locations
HOREXS Group operates two manufacturing facilities: one in Huizhou City, Guangdong, and another in Hubei Province.
Minimum Order Requirements
HOREXS does not impose any minimum order quantity (MOQ) or minimum order value (MOV) requirements for clients.
Production Capacity
Yes, we support high-volume production with capacities of 15,000 sqm/month at our Guangdong facility and 50,000 sqm/month at our Hubei facility.
Contact Information
Contact Person: AKEN
Email: akenzhang@horexspcb.com
Services: Technical support, roadmap files, design rules, production capability documentation
IC Package Design Services
No, we do not provide IC package or IC design services. We specialize exclusively in semiconductor IC substrate manufacturing, though we can facilitate connections with partner companies.
Quotation Requirements
- Gerber files
- Production specifications
- Buildup/stackup information for multilayer substrates
- Additional files beneficial for accurate quotation
FCBGA Package Substrate
No, FCBGA substrate manufacturing is planned for implementation in 2024 or 2025 according to HOREXS roadmap.
For high-volume customers: Please provide detailed requirements. HOREXS offers technical support to help reduce costs while maintaining high quality standards. Our mission is to deliver cost-effective solutions with guaranteed quality.
Shipping Options
- DHL, UPS, FedEx courier services
- Air freight and sea freight
- Custom express services using our DHL/UPS/FedEx accounts
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu