HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
Verified Supplier
16 Years
Since 2010
Menu
Security & Protection IoT Solutions & Software

BGA/QFN Package Substrate for IoT Electronics - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom Manufacturing

Price Negotiable
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
BGA/QFN Package Substrate Production for IoT Applications
Applications
  • Smart electronics
  • Smart health electronics
  • Smart agricultural electronics
  • IoT industry electronics
  • Smart express electronics
  • Other specialized applications
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finish Mainly immersion gold, customizable options including OSP/Immersion silver, tin, and more
Copper 0.5oz or customizable
Layers 1-6 layers (customizable)
Soldermask Green or customizable (Brands: TAIYO INK, ABQ)
BGA/QFN package substrate manufacturing facility and production process
Manufacturer Profile

HOREXS-Hubei, part of HOREXS Group, is a leading and rapidly growing Chinese IC substrate manufacturer located in Huangshi city, Hubei province. The facility spans over 60,000 square meters with an investment exceeding $300 million USD. Annual production capacity reaches 600,000 square meters using Tenting & SAP processes.

Advanced Manufacturing Capabilities
  • Line/Space: 20/20μm, 10/10μm
  • BT+ABF materials compatibility
  • Wire bonding substrate support (BGA)
  • Embedded memory IC substrate
  • MEMS/CMOS, Module (RF, Wireless, Bluetooth)
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology (Buried/Blind hole)
  • Flipchip CSP and other ultra IC package substrates
Inquiry Requirements
  • Substrate production specification information
  • Gerber files and drilling files
  • Quantity requirements including samples
  • For multilayer substrates: layer stack-up/build-up information
Get Started Today

For large volume customers, we provide comprehensive technical support. Our mission is to help you achieve cost savings while maintaining high quality standards.

Want better pricing and superior quality substrates? Contact HOREXS now!

Shipping Options
  • DHL/UPS/FedEx
  • Air freight
  • Custom express services (DHL/UPS/FedEx)

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.