BGA Memory Substrate Manufacturing - 10/10μm Line Width, 0.21mm Thickness for DDR and Flash Devices
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
BGA Memory Substrate Overview
BGA (Ball Grid Array) packaging represents a critical semiconductor packaging technology for memory electronics manufacturing. These substrates provide essential high-quality connections between memory integrated circuits and PCBs while protecting internal circuitry, managing heat dissipation, and serving as standardized IC component modules.
Applications
- DDR Memory Modules
- MicroSD Devices
- Flash Memory Devices
- Computer Electronics
- SD Cards / Memory Cards
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.21mm |
| Copper Thickness | 12μm |
| Layer Count | 2 Layers |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Soldermask/PSR | Green Taiyo Brand/AUS 308/AUS 320/AUS 410/SR-1700, 300 Series |
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 square meter facility in Huangshi City, Hubei Province, China. With over $300 million USD investment, the facility delivers annual IC substrate capacity of 600,000 square meters using Tenting & SAP processes.
Advanced Technology
Supports line/space down to 10/10μm, BT+ABF materials, and various packaging technologies including Wire Bonding, Embedded Memory IC Substrate, MEMS/CMOS, RF/Wireless/Bluetooth Modules, and Flipchip CSP.
Frequently Asked Questions
Company Locations
HOREXS operates two manufacturing facilities: original factory in Huizhou City, Guangdong and new facility in Hubei Province.
Order Requirements
No minimum order quantity (MOQ) or minimum order value (MOV) restrictions currently apply.
Production Capacity
Original factory: 15,000 sqm/month | New factory: 50,000 sqm/month
Quotation Requirements
Submit Gerber files, production specifications, buildup/stackup information for multilayer substrates, and any additional relevant documentation.
FCBGA Capability
FCBGA substrate manufacturing scheduled for implementation in 2024-2025.
Contact Information
Contact Person: AKEN
Email: akenzhang@horexspcb.com
Technical support includes roadmap documentation, design rules files, and production capability specifications.
Shipping Options
- DHL / UPS / FedEx
- Air Freight / Sea Freight
- Custom Express Services (Using DHL/UPS/FedEx accounts)
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu