Ultra-Thin 0.13mm IC Substrate PCB for SIM Cards & Smart Devices with 10/10μm Line Width
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
IC Substrate PCB for SIM and Smart Card Applications
Specialized IC substrate PCB designed for SIM cards, smart cards, and IoT devices requiring ultra-thin construction, stable quality, and long-term reliability at competitive production costs.
Primary Applications
- SIM Cards
- IoT Devices
- Smart Card Systems
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.13mm |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layers | 2 Layer |
| Soldermask/PSR | Green Taiyo Brand/AUS 308/AUS 320/AUS 410/SR-1700, 300 Series |
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes, supporting line/space down to 10/10μm with BT+ABF materials.
Technical Support
- Wire Bonding Substrate
- Embedded Memory IC Substrate
- MEMS/CMOS Modules (RF, Wireless, Bluetooth)
- 2/4/6 Layer Build-up (1+2+1/2+2+2/1+4+1)
- Buildup with Buried/Blind Vias
- Flipchip CSP
Frequently Asked Questions
Company Locations
HOREXS operates two factories: original facility in Huizhou City, Guangdong and new facility in Hubei Province.
Order Requirements
No minimum order quantity (MOQ) or minimum order value (MOV) requirements currently in place.
Production Capacity
Old factory: 15,000 SQM/month, New factory: 50,000 SQM/month for high-volume production.
Contact Information
Contact: AKEN
Email: akenzhang@horexspcb.com
Support includes roadmap files, design rules, and production capability documentation.
IC Package & Design Services
HOREXS specializes in semiconductor IC substrate manufacturing only. We can facilitate connections with partners for IC package and design services.
Quotation Requirements
- Gerber files
- Production specifications
- Buildup/stackup information for multilayer substrates
- Additional files beneficial for quotation
FCBGA Package Substrate
FCBGA substrate manufacturing is planned to begin in 2024 or 2025 according to HOREXS roadmap.
For enterprise customers: Please provide detailed requirements. HOREXS offers technical support to help reduce costs while maintaining high quality standards.
Shipping Options
- DHL / UPS / FedEx
- Air Freight / Sea Freight
- Custom Express Services (Using HOREXS DHL/UPS/FedEx accounts)
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu