IC substrate is an advanced packaging substrate developed from HDI board technology, designed to meet the rapid evolution of electronic packaging. It offers exceptional characteristics including high density, precision, performance, miniaturization, and thin profiles. The complete chip consists of the bare chip (wafer) and packaging components (substrate, sealing material, leads).

The substrate serves as the core packaging material, protecting, securing, and supporting the chip while providing thermal management. It ensures physical protection and establishes electrical connections between the chip and printed circuit board for power distribution, signal transmission, and internal/external circuit communication.

• DDR memory devices
• NAND memory devices
• Flash memory electronics
• Smart electronics
• SD cards / memory cards

HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer in China with over 60,000 square meters of production space and $300 million USD investment. Annual capacity reaches 600,000 square meters using Tenting & SAP processes.

Advanced technologies include L/S 20/20μm and 10/10μm capabilities with BT+ABF materials. Supports wire bonding substrates, embedded memory IC substrates, MEMS/CMOS, and module applications (RF, Wireless, Bluetooth).

• No minimum order quantity (MOQ) requirements
• High-volume production capacity: 15,000 sqm/month (Guangdong) and 50,000 sqm/month (Hubei)
• Technical support for roadmap and design rules
• Layer configurations: 2/4/6L (1+2+1/2+2+2/1+4+1)
• Buildup technology with buried/blind vias
• Flipchip CSP packaging

• DHL / UPS / FedEx
• Air freight / Sea freight
• Custom express services