NAND/Flash Memory IC Substrate Manufacturing - 0.18mm Thickness, 1-6 Layers, 25μm Line Width
IC packaging, semiconductor packaging, memory electronics, NAND/Flash memory substrates
| Specification | Value |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Mainly immersion gold, customizable options including OSP, immersion silver, tin, and more |
| Copper Weight | 0.5oz or Customizable |
| Layers | 1-6 layers (Customizable) |
| Soldermask | Green or Customizable (Brands: TAIYO INK, ABQ) |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. With over 13 years of experience in NAND/Flash memory substrate manufacturing, our facility spans 60,000 square meters with an investment exceeding $300 million USD.
- Annual IC Substrate Capacity: 600,000 SQM
- Advanced Tenting & SAP Processes
- Advanced Technology: L/S 20/20μm, 10/10μm
- BT+ABF Material Compatibility
- Wire Bonding Substrate (BGA)
- Embedded Memory IC Substrate
- MEMS/CMOS, Module (RF, Wireless, Bluetooth)
- 2/4/6 Layer Configurations (1+2+1/2+2+2/1+4+1)
- Buildup (Buried/Blind Hole) Flipchip CSP
- Other Ultra IC Package Substrate Solutions
For accurate quotations and technical support, please provide the following information:
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
Contact HOREXS today for competitive pricing and high-quality IC substrate manufacturing. Our mission is to help you save costs while maintaining superior quality standards.
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