China 4-Layer Gold Bonding IC Package Substrate 0.29mm Thickness 25μm Line Width OEM ODM Manufacturing for sale

4-Layer Gold Bonding IC Package Substrate 0.29mm Thickness 25μm Line Width OEM ODM Manufacturing

Price Negotiable

Price: Depend on customized spec.

MOQ: Sample or Mass production

Delivery Time: 7-10 working days

Brand: Horexs

Product Description

Product Overview

HOREXS offers OEM/ODM 4-layer gold bonding IC package substrates designed for advanced semiconductor packaging applications. These substrates feature ultra-fine line capabilities and support various memory card formats and IC assembly requirements.

Applications

IC substrate and IC package PCB manufacturing
IC/chip assembly and semiconductor packaging
Memory cards: TF card, UDP, SD card, MicroSD, MicroTF
Wearable electronics and Nand/Flash memory packaging
RF, wireless, Bluetooth modules

Technical Specifications

Parameter	Specification
Minimum Line Space/Width	1 mil (25μm)
Finished Thickness	0.29mm
Copper Weight	0.5oz or Customizable
Layer Count	4 layers (Customizable)
Surface Finish	Immersion gold (OSP/Immersion silver/tin customizable)
Soldermask	Green or Customizable (TAIYO INK)
Material Brands	SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic

Manufacturing Capabilities

HOREXS-Hubei Facility: 60,000 square meters production area with $300 million USD investment

Annual Capacity: 600,000 square meters of IC substrates

Advanced Technology: L/S 20/20μm, 10/10μm capabilities with BT+ABF materials

Wire bonding substrates (BGA)
Embedded memory IC substrates
MEMS/CMOS packaging
Module substrates (RF, wireless, Bluetooth)
2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
Buildup technology with buried/blind vias
Flipchip CSP and ultra IC package substrates

Inquiry Requirements

Complete substrate production specifications
Gerber files and drilling files
Quantity requirements including samples
Layer stack-up information for multilayer substrates

Technical Support: Available for high-volume customers with custom requirements

Shipping Options: DHL, UPS, FedEx, air freight, and customized express services

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.

Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

Contact Person Mark Liu

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