0.2mm 4L BT Memory Substrate 0.18mm Thickness 25μm Line Width JEDEC Standard IC Package
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
0.2mm 4L BT Memory Substrate Manufacturing
High-performance IC substrate manufactured to JEDEC standards for memory electronics and semiconductor packaging applications.
Product Specifications
| Parameter | Specification |
|---|---|
| Finished Thickness | 0.18mm |
| Minimum Line Space/Width | 1mil (25μm) |
| Copper Weight | 0.5oz or Custom |
| Layers | 1-6 Layers (Custom) |
| Surface Finish | Immersion Gold (Custom: OSP/Immersion Silver/Tin) |
| Soldermask | Green or Custom (TAIYO INK, ABQ brands) |
Material Brands
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Applications
- IC Package & Semiconductor Package
- Memory Electronics
- NAND/Flash Memory
- Wire Bonding Substrate (BGA)
- Embedded Memory IC Substrate
- MEMS/CMOS Modules (RF, Wireless, Bluetooth)
- Flipchip CSP
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 sqm facility with annual IC substrate capacity of 600,000 SQM. Advanced technologies include L/S 20/20μm, 10/10μm processing with BT+ABF materials.
Inquiry Requirements
- Substrate production specifications
- Gerber and drilling files
- Quantity requirements (including samples)
- Layer stack-up/build-up information for multilayer substrates
Technical Support & Cost Savings
HOREXS provides comprehensive technical support for high-volume customers, delivering quality assurance while helping reduce production costs.
Shipping Options
DHL, UPS, FedEx, Air Freight, Custom Express Services
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu