0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness
0.2mm 2-layer memory card substrate designed for high-performance encapsulation applications in semiconductor packaging. This precision substrate supports various memory card formats and IC assembly requirements.
- Memory cards (Micro SD, Micro TF, UDP)
- USB devices and chip substrates
- IC assembly substrates and semiconductor packaging
- Wearable electronics and NAND/Flash memory packages
- RF, wireless, and Bluetooth modules
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.29mm |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 4 layers (Customizable) |
| Surface Finish | Immersion gold (OSP/Immersion silver/tin available) |
| Soldermask | Green (Customizable, TAIYO INK brand) |
Premium material brands including SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
HOREXS Group - Leading IC substrate manufacturer with 60,000㎡ facility and $300M investment. Annual capacity: 600,000 SQM with Tenting & SAP processes.
- Advanced technology: L/S 20/20μm, 10/10μm
- BT+ABF materials support
- Wire bonding substrates and embedded memory IC substrates
- Flipchip CSP and buildup (buried/blind hole) technologies
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Contact HOREXS for competitive pricing, superior quality substrates, and comprehensive technical support. Our mission is to help you save costs while maintaining high-quality standards.
Shipping Options: DHL, UPS, FedEx, air freight, and customized express services.
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