HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China High Precision MicroLED/MiniLED Package Substrate 0.4mm BT Thickness with 25μm Line Width for LED Displays for sale
China High Precision MicroLED/MiniLED Package Substrate 0.4mm BT Thickness with 25μm Line Width for LED Displays for sale
China High Precision MicroLED/MiniLED Package Substrate 0.4mm BT Thickness with 25μm Line Width for LED Displays for sale

High Precision MicroLED/MiniLED Package Substrate 0.4mm BT Thickness with 25μm Line Width for LED Displays

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
High Precision MicroLED/MiniLED Package Substrate
Advanced LED Package Substrate with 0.4mm Finished BT Thickness
ROHS Compliant for Environmental Safety
Primary Applications
  • LED Lighting Systems
  • LED Display Panels
  • Outdoor LED PCB Applications
  • MiniLED Technology Integration
  • Advanced Lighting PCB Solutions
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1mil (25μm)
Finished Thickness FR4/BT (0.1-0.4mm)
Copper Thickness 0.5oz or Customizable
Layer Count 1-6 Layers (Customizable)
Surface Finish Immersion Gold, OSP, Silver, Tin (Customizable)
Soldermask Green or Custom Colors (TAIYO INK, ABQ Brands)
Premium Material Brands
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Manufacturing Excellence
HOREXS-Hubei, part of HOREXS Group, stands as a leading IC substrate manufacturer in China. Our 60,000 square meter facility represents a $300 million investment with annual production capacity of 600,000 square meters. We specialize in advanced Tenting & SAP processes with capabilities reaching L/S 20/20μm and 10/10μm technology nodes.
Advanced Technology Capabilities
  • Wire Bonding Substrate (BGA)
  • Embedded Memory IC Substrate
  • MEMS/CMOS Integration
  • RF, Wireless, Bluetooth Modules
  • 2/4/6 Layer Build-up Structures
  • Flipchip CSP Technology
  • Buried/Blind Via Construction
Inquiry Requirements
  • Complete substrate production specifications
  • Gerber files with drilling data
  • Quantity requirements including samples
  • Layer stack-up information for multilayer designs
Global Shipping Support: DHL, UPS, FedEx, Air Freight, Custom Express Services
Partner with HOREXS for Superior Quality and Competitive Pricing
Our mission: Deliver cost-effective solutions without compromising on quality standards.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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