Ultra-Thin MEMS Package Substrate 0.1-0.4mm Thickness with 25μm Line Width for Semiconductor Manufacturing
Advanced ultrathin MEMS PCB substrates with integrated capacitors and resistors for high-performance semiconductor applications.
- MEMS semiconductor packaging
- MEMS and CMOS integrated circuits
- IC substrate manufacturing
- Acoustics and pressure electronics
- Specialized electronic applications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | BT material (0.1-0.4mm) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (custom options: OSP, immersion silver, tin) |
| Copper Weight | 0.5oz or customized |
| Layer Count | 1-6 layers (customizable) |
| Soldermask | Green or customized (Brands: TAIYO INK, ABQ) |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. Our 60,000 square meter facility represents a $300 million USD investment with annual IC substrate capacity of 600,000 SQM using Tenting & SAP processes.
- Line/Space: 20/20μm, 10/10μm capability
- BT+ABF material compatibility
- Wire bonding substrate support (BGA)
- Embedded memory IC substrate technology
- MEMS/CMOS and module support (RF, Wireless, Bluetooth)
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and advanced IC package substrates
For accurate quotations and technical support, please provide:
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
We support worldwide shipping via DHL, UPS, FedEx, air freight, and customized express services.
For superior pricing and quality in MEMS package substrates, contact Horexs for customized technical solutions and cost-effective manufacturing.
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