HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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16 Years
Since 2010
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Ultra-Thin MEMS Package Substrate 0.1-0.4mm Thickness with 25μm Line Width for Semiconductor Manufacturing

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
Ultra-Thin MEMS Package Substrate Manufacturing

Advanced ultrathin MEMS PCB substrates with integrated capacitors and resistors for high-performance semiconductor applications.

Applications
  • MEMS semiconductor packaging
  • MEMS and CMOS integrated circuits
  • IC substrate manufacturing
  • Acoustics and pressure electronics
  • Specialized electronic applications
Substrate Production Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness BT material (0.1-0.4mm)
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (custom options: OSP, immersion silver, tin)
Copper Weight 0.5oz or customized
Layer Count 1-6 layers (customizable)
Soldermask Green or customized (Brands: TAIYO INK, ABQ)
Horexs Ultra-thin MEMS Package Substrate Manufacturing Process
Horexs Manufacturing Capabilities

HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi city, Hubei province, China. Our 60,000 square meter facility represents a $300 million USD investment with annual IC substrate capacity of 600,000 SQM using Tenting & SAP processes.

Advanced Technology Features
  • Line/Space: 20/20μm, 10/10μm capability
  • BT+ABF material compatibility
  • Wire bonding substrate support (BGA)
  • Embedded memory IC substrate technology
  • MEMS/CMOS and module support (RF, Wireless, Bluetooth)
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology with buried/blind vias
  • Flipchip CSP and advanced IC package substrates
Inquiry Requirements

For accurate quotations and technical support, please provide:

  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up/build-up information for multilayer substrates
Shipping & Logistics

We support worldwide shipping via DHL, UPS, FedEx, air freight, and customized express services.

Contact Horexs Today

For superior pricing and quality in MEMS package substrates, contact Horexs for customized technical solutions and cost-effective manufacturing.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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