0.2mm Thickness Semiconductor Assembly Substrate - 0.18mm Finished, 25μm Line Width, 1-6 Layer Customizable
0.2mm thickness semiconductor assembly substrate designed for advanced microelectronics packaging applications including IC packaging, semiconductor packaging, and memory electronics.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 1-6 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Immersion gold (Customizable: OSP, Immersion silver, tin, more) |
| Soldermask | Green (Customizable) - Brands: TAIYO INK, ABQ |
- IC Package Substrates
- Semiconductor Packaging
- Memory Electronics
- NAND/Flash Memory
- Wire Bonding Substrates (BGA)
- Embedded Memory IC Substrates
- MEMS/CMOS Modules
- RF, Wireless, Bluetooth Modules
- Flipchip CSP
HOREXS-Hubei, part of HOREXS Group, operates a 60,000 square meter facility with over $300 million USD investment. Annual IC substrate production capacity reaches 600,000 square meters utilizing Tenting & SAP processes.
Advanced technology capabilities include L/S 20/20μm and 10/10μm processing with BT+ABF materials support.
For accurate quotation and production planning, please provide:
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- For multilayer substrates: layer stack-up/build-up information
Contact HOREXS for competitive pricing on high-quality IC substrates with comprehensive technical support for large-volume customers.
- DHL/UPS/FedEx Express
- Air Freight
- Custom Express Services (DHL/UPS/FedEx)
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.