RF/mmWave Module Substrate Manufacturing - 25μm Line Width, 0.18mm Thickness, 1-6 Layer Custom IC Packaging
IC packaging, microelectronics devices, microelectronics assembly, semiconductor packaging, memory electronics, NAND/Flash memory, and advanced module applications.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Immersion gold (primary), OSP, immersion silver, tin, and custom options |
| Copper Weight | 0.5oz or customized |
| Layer Count | 1-6 layers (customizable) |
| Soldermask | Green or customized (TAIYO INK, ABQ brands) |
- Advanced technology: L/S 20/20μm, 10/10μm
- BT+ABF materials compatibility
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS and module applications (RF, Wireless, Bluetooth)
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and advanced IC packaging
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of production space and over $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes. Committed to becoming a top-three IC substrate manufacturer in China and world-class PCB manufacturer.
- Substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up/build-up information for multilayer substrates
Contact HOREXS for competitive pricing and high-quality IC substrates. Technical support available for large customers. Shipping via DHL, UPS, FedEx, and air freight options.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.